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Moscow

Physical Address:
Integrated Research & Innovation Center 
685 South Line Street 
Moscow, ID 83844

Mailing Address:
FIBSEM Laboratory
University of Idaho 
875 Perimeter Drive, MS 1122 
Moscow, ID 83844-1122

Phone: 208-885-1063

Email: fibsem@uidaho.edu

Web: Dual-Beam FIB/SEM Laboratory

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Our People

Feng Li, Ph.D., P.E.

Micron Endowed Chair in Microelectronics, NGeM Director, FIB/SEM Director

Gauss-Johnson 217

208-885-7571

fengli@uidaho.edu

Campus: Moscow
Classes: Microelectronics I, Microelectronics I Lab, Electromagnetic Theory, Electromagnetics Lab, Signals and Systems I, Signals and Systems I Lab, Introduction to Electronic Packaging, Introduction to VLSI Design, Semiconductor Devices, Introduction to Microelectronics Fabrication, Senior Design I, Senior Design II
Areas of Expertise: Semiconductor device and IC design, Micro/nanofabrication and electronic packaging, ML/AI in VLSI design and manufacturing

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Contact

Moscow

Physical Address:
Integrated Research & Innovation Center 
685 South Line Street 
Moscow, ID 83844

Mailing Address:
FIBSEM Laboratory
University of Idaho 
875 Perimeter Drive, MS 1122 
Moscow, ID 83844-1122

Phone: 208-885-1063

Email: fibsem@uidaho.edu

Web: Dual-Beam FIB/SEM Laboratory

Get Directions